Prof. Dr.-Ing. Ulrich Tetzlaff
Programme director and Academic advisor Material Science in Engineering (Master)
Room:
A232
Subject Area:
Materials Science, Chipless Manufacturing Technology and Advanced Composites
Research
- Creep and fatigue behaviour of metallic composites
- Tribology of metallic composites
- High-temperature behaviour of lead-free solder materials
Vita
- Since 2009: Professor at THI, Laboratory Officer of the Faculty of Mechanical Engineering, Head of the Materials Analysis Laboratory
- 2001-2008: AUDI AG: Metallurgy of Aggregates
- 1990-2000: Studies in Materials Science, Research Assistant at the Institute for General Material Properties, PhD
Publications
2024
ERNST, Benedikt
,
Paul KUBASCHINSKI
,
Andreas SCHIESSL
,
Manuela WALTZ
,
Heinz Werner HÖPPEL
and
Ulrich TETZLAFF
, 2024
.
Comparison of the Young’s modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and ????-Sn single crystal calculations
.
Materials Science and Engineering: A
, 2024
,
147354
.
ISSN 1873-4936.
Available at
: https://doi.org/10.1016/j.msea.2024.147354