Prof. Dr. Gordon Elger

Head of Fraunhofer Application Center "Connected Mobility and Infrastructure"; Research Professor Assembly and Connection Technology

Room: A114
Subject Area: Electronic and it‘s Manufacturing Technologies
Faculty: Fakultät E

Research

Vita

  • Since 2016 Research Professor Assembly and Connection Technology
  • Since 2013 at THI
  • 1999 - 2002, Fraunhofer Institut for Reliability and Microintegration, Scientific Coworker
  • 2002 - 2004, Hymite GmbH Berlin, Teamleader Microelectronic Packaging
  • 2005 - 2007, Electrolux Italy, R&D Manager CAE (Structural Analysis and Heatmanagement)
  • PhD, Free University of Berlin
  • Physics studies, Free University of Berlin

Publications

  • Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks, A. Zippelius, A. Hanß, M. Schmid, J. Perez-Velazquez, G. Elger, Microelectronics Reliability 129 (2022) 114461, doi.org/10.1016/j.microrel.2021.114461
  • Die-attach bonding with etched micro brass metal pigment flakes for high power electronics packaging, S. K. Bhogaraju, H. R. Kotadia, F. Conti, A. Mauser, T. Rubenbauer, R. Bruetting, M. Schneider-Ramelow, G. Elger, ACS Applied Electronic Materials, 2021, Article ASAP, DOI: 10.1021/acsaelm.1c00721
  • Predictive maintenance enabled by machine learning: Use cases and challenges in the automotive industry, A. Theissler, J. Perez-Velazquez, M. Kettelgerdes, G. Elger, Reliability Engineering & System Safety, 2021, 215(19):107864, DOI:10.1016/j.ress.2021.107864
  • Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics, M. Schmid, S. K. Bhogaraju, E Liu, G. Elger,  2020, Applied Sciences 10(23):8516, DOI: 10.3390/app10238516
  • Analysis of Thermomechanical Stress in GaN LEDs Soldered on Cu Substrate by Finite Element Method and RAMAN Spectroscopy, E Liu, F. Conti , S.K. Bhogarajua, R. Signorini, D. Pedron, B. Wunderle, G. Elger, Journal of Raman Spectroscopy 2020;1–12, DOI: 10.1002/jrs.5947

Awards and memberships

  • Member of International Microelectronics and Packaging Society (IMAPS)

Publikationen

2025
MOHAN, Nihesh, Fabian STEINBERGER, Sonja WÄCHTER, Hüseyin ERDOGAN und Gordon ELGER, 2025. Additive Manufacturing for Automotive Radar Sensors Using Copper Inks and Pastes. Applied Sciences, 15(5), 2676. ISSN 2076-3417. Available at: https://doi.org/10.3390/app15052676
MOHD, Zubair Akhtar, Maximilian SCHMID und Gordon ELGER, 2025. AI-Driven Point Cloud Framework for Predicting Solder Joint Reliability using 3D FEA Data [Preprint]. Research Square. Available at: https://doi.org/10.21203/rs.3.rs-6173485/v1
MOHAN, Nihesh, Juan Ignacio AHUIR-TORRES, Hiren R. KOTADIA und Gordon ELGER, 2025. Laser sintering of Cu particle-free inks for high-performance printed electronics. npj Flexible Electronics, 9(1), 18. ISSN 2397-4621. Available at: https://doi.org/10.1038/s41528-025-00389-5
2024
HAN, Longfei, Qiuyu XU, Klaus KEFFERPÜTZ, Gordon ELGER und Jürgen BEYERER, 2024. Applying Extended Object Tracking for Self-Localization of Roadside Radar Sensors [Preprint]. arXiv. Available at: https://doi.org/10.48550/arXiv.2407.03084
KETTELGERDES, Marcel, Amit PANDEY, Denis UNRUH, Hüseyin ERDOGAN, Bernhard WUNDERLE und Gordon ELGER, 2024. Automotive LiDAR Based Precipitation State Estimation Using Physics Informed Spatio-Temporal 3D Convolutional Neural Networks (PIST-CNN). 2023 29th International Conference on Mechatronics and Machine Vision in Practice (M2VIP). Piscataway: IEEE. ISBN 979-8-3503-2562-1. Available at: https://doi.org/10.1109/M2VIP58386.2023.10413394
MOHAN, Nihesh, Juan Ignacio AHUIR-TORRES, Sri Krishna BHOGARAJU, Ralf WEBLER, Hiren R. KOTADIA, Hüseyin ERDOGAN und Gordon ELGER, 2024. Decomposition mechanism and morphological evolution of in situ realized Cu nanoparticles in Cu complex inks. New Journal of Chemistry, 48(15), 6796-6808. ISSN 1369-9261. Available at: https://doi.org/10.1039/D3NJ05185D
OLCAY, Ertug, Henri MEESS und Gordon ELGER, 2024. Dynamic Obstacle Avoidance for UAVs using MPC and GP-Based Motion Forecast. 2024 European Control Conference (ECC). Piscataway: IEEE, Page 1024-1031. ISBN 978-3-9071-4410-7. Available at: https://doi.org/10.23919/ECC64448.2024.10591083
MEESS, Henri, Jeremias GERNER, Daniel HEIN, Stefanie SCHMIDTNER, Gordon ELGER und Klaus BOGENBERGER, 2024. First steps towards real-world traffic signal control optimisation by reinforcement learning. Journal of Simulation, 18(6), 957-972. ISSN 1747-7778. Available at: https://doi.org/10.1080/17477778.2024.2364715
HAN, Longfei, Klaus KEFFERPÜTZ, Gordon ELGER und Jürgen BEYERER, 2024. FlexSense: Flexible Infrastructure Sensors for Traffic Perception. 2023 IEEE 26th International Conference on Intelligent Transportation Systems (ITSC). Piscataway: IEEE, Page 3810-3816. ISBN 979-8-3503-9946-2. Available at: https://doi.org/10.1109/ITSC57777.2023.10422616
MOHD, Zubair Akhtar, Christian KREINER, Maximilian SCHMID, Andreas ZIPPELIUS, Ulrich TETZLAFF und Gordon ELGER, 2024. Fully Connected Neural Network (FCNN) Based Validation Framework for FEA Post Processing to Improve SAC Solder Reliability Analysis. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Available at: https://doi.org/10.1109/ESTC60143.2024.10712023
ELGER, Gordon, Sri Krishna BHOGARAJU und Martin SCHNEIDER-RAMELOW, 2024. Hybrid Cu sinter paste for low temperature bonding of bare semiconductors. Materials Letters, 2024(372), 136973. ISSN 1873-4979. Available at: https://doi.org/10.1016/j.matlet.2024.136973
SCHWAN, Hannes, Maximilian SCHMID und Gordon ELGER, 2024. Layer Resolved Thermal Impedance Measurement with Laser Stimulated Transient Thermal Analysis of Semiconductor Modules. THERMINIC 2024: Proceedings of 2024, 30th International Workshop on Thermal Investigations of ICs and Systems. Piscataway: IEEE. ISBN 979-8-3503-8782-7. Available at: https://doi.org/10.1109/THERMINIC62015.2024.10732233
MOHD, Zubair Akhtar, Maximilian SCHMID, Andreas ZIPPELIUS und Gordon ELGER, 2024. LEDs Lifetime Prediction Modeling: Thermomechanical Simulation for SAC305 and SAC105. 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 979-8-3503-9363-7. Available at: https://doi.org/10.1109/EuroSimE60745.2024.10491530
STEINBERGER, Fabian, Nihesh MOHAN, Olaf RÄMER und Gordon ELGER, 2024. Low temperature die-attach bonding using copper particle free inks. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Available at: https://doi.org/10.1109/ESTC60143.2024.10712150
BHOGARAJU, Sri Krishna, Nihesh MOHAN, Fabian STEINBERGER, Hüseyin ERDOGAN, Philipp HADRAVA und Gordon ELGER, 2024. Novel Low Temperature and Low Pressure Sintering of ADAS Radar Sensor Antenna Stack. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Available at: https://doi.org/10.23919/EMPC55870.2023.10418277
KETTELGERDES, Marcel, Nicolas SARMIENTO, Hüseyin ERDOGAN, Bernhard WUNDERLE und Gordon ELGER, 2024. Precise Adverse Weather Characterization by Deep-Learning-Based Noise Processing in Automotive LiDAR Sensors. Remote Sensing, 16(13), 2407. ISSN 2072-4292. Available at: https://doi.org/10.3390/rs16132407
MOHAN, Nihesh, Juan Ignacio AHUIR-TORRES, Sri Krishna BHOGARAJU, Hiren R. KOTADIA und Gordon ELGER, 2024. Rapid Sintering of Inkjet Printed Cu Complex Inks Using Laser in Air. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Available at: https://doi.org/10.23919/EMPC55870.2023.10418323
BHOGARAJU, Sri Krishna, Francesco UGOLINI, Federico BELPONER, Alessio GRECI und Gordon ELGER, 2024. Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Available at: https://doi.org/10.23919/EMPC55870.2023.10418348
HAN, Longfei, Qiuyu XU, Klaus KEFFERPÜTZ, Ying LU, Gordon ELGER und Jürgen BEYERER, 2024. Scalable Radar-based Roadside Perception: Self-localization and Occupancy Heat Map for Traffic Analysis. 2024 IEEE Intelligent Vehicles Symposium (IV). Piscataway: IEEE, Page 1651-1657. ISBN 979-8-3503-4881-1. Available at: https://doi.org/10.1109/iv55156.2024.10588397
AGRAWAL, Shiva, Savankumar BHANDERI und Gordon ELGER, 2024. Semi-Automatic Annotation of 3D Radar and Camera for Smart Infrastructure-Based Perception. IEEE Access, 12, 34325-34341. ISSN 2169-3536. Available at: https://doi.org/10.1109/ACCESS.2024.3373310
MOHD, Zubair Akhtar, Maximilian SCHMID, Andreas ZIPPELIUS und Gordon ELGER, 2024. Solder joint lifetime model using AI framework operating on FEA data. Engineering Failure Analysis, 2025(167), 109032. ISSN 1350-6307. Available at: https://doi.org/10.1016/j.engfailanal.2024.109032
PARET, Paul, Sri Krishna BHOGARAJU, Dirk BUSSE, Alexander DAHLBÜDDING, Gordon ELGER und Sreekant NARUMANCHI, 2024. Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock. Proceedings: IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Piscataway: IEEE, Page 1219-1224. ISBN 979-8-3503-7598-5. Available at: https://doi.org/10.1109/ECTC51529.2024.00196
AHUIR-TORRES, Juan Ignacio, Sri Krishna BHOGARAJU, Geoff WEST, Gordon ELGER und Hiren R. KOTADIA, 2024. Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application. 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Piscataway: IEEE. ISBN 978-0-9568086-9-1. Available at: https://doi.org/10.23919/EMPC55870.2023.10418365
LIU, E, Zubair Akhtar MOHD, Fabian STEINBERGER, Bernhard WUNDERLE und Gordon ELGER, 2024. Using µ-RAMAN Spectroscopy to Inspect Sintered Interconnects. 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Proceedings. Piscataway: IEEE. ISBN 979-8-3503-9036-0. Available at: https://doi.org10.1109/ESTC60143.2024.10712149
2023
STEINBERGER, Fabian, Sri Krishna BHOGARAJU und Gordon ELGER, 2023. Correlation between the characteristics of printed sinter paste and the quality of sintered interconnects through non-destructive analysis techniques. NordPac 2023 Annual Microelectronics and Packaging Conference and Exhibition: Reviewed Papers. Piscataway: IEEE. ISBN 978-91-89821-06-4. Available at: https://doi.org/10.23919/NordPac58023.2023.10186250
PANDEY, Amit, Denis UNRUH, Marcel KETTELGERDES, Bernhard WUNDERLE und Gordon ELGER, 2023. Evaluation of thermally-induced change in sharpness of automotive cameras by coupled thermo-mechanical and optical simulation. In: MATOBA, Osamu, Joseph A. SHAW und Christopher R. VALENTA, Editors SPIE Future Sensing Technologies 2023. Bellingham: SPIE. ISBN 9781510657236. Available at: https://doi.org/10.1117/12.2665475
KETTELGERDES, Marcel und Gordon ELGER, 2023. In-Field Measurement and Methodology for Modeling and Validation of Precipitation Effects on Solid-State LiDAR Sensors. IEEE Journal of Radio Frequency Identification, 7, 192-202. ISSN 2469-7281. Available at: https://doi.org/10.1109/JRFID.2023.3234999
AGRAWAL, Shiva, Savankumar BHANDERI, Sumit AMANAGI, Kristina DOYCHEVA und Gordon ELGER, 2023. Instance Segmentation and Detection of Children to Safeguard Vulnerable Traffic User by Infrastructure. In: VINEL, Alexey, Jeroen PLOEG, Karsten BERNS und Oleg GUSIKHIN, Editors Proceedings of the 9th International Conference on Vehicle Technology and Intelligent Transport Systems. Setúbal: SciTePress, Page 206-214. ISBN 978-989-758-652-1. Available at: https://doi.org/10.5220/0011825400003479
AGRAWAL, Shiva, Rui SONG, Kristina DOYCHEVA, Alois KNOLL und Gordon ELGER, 2023. Intelligent Roadside Infrastructure for Connected Mobility. In: KLEIN, Cornel, Matthias JARKE, Jeroen PLOEG, Markus HELFERT, Karsten BERNS und Oleg GUSIKHIN, Editors Smart Cities, Green Technologies, and Intelligent Transport Systems: 11th International Conference, SMARTGREENS 2022 and 8th International Conference, VEHITS 2022: Revised Selected Papers. Cham: Springer, Page 134-157. ISBN 978-3-031-37470-8. Available at: https://doi.org/10.1007/978-3-031-37470-8_6
SCHMID, Maximilian, Andreas ZIPPELIUS, Alexander HANSS, Stephan BÖCKHORST und Gordon ELGER, 2023. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II - Reliability. IEEE Transactions on Device and Materials Reliability, 23(3), 419-429. ISSN 1558-2574. Available at: https://doi.org/10.1109/TDMR.2023.3300355
SENEL, Numan, Klaus KEFFERPÜTZ, Kristina DOYCHEVA und Gordon ELGER, 2023. Multi-Sensor Data Fusion for Real-Time Multi-Object Tracking. Processes, 11(2), 501. ISSN 2227-9717. Available at: https://doi.org/10.3390/pr11020501
KETTELGERDES, Marcel, Peter MEZMER, Michael J. HAEUSSLER, Gunnar BÖTTGER, Majid TAVAKOLIBASTI, Amit PANDEY, Hüseyin ERDOGAN, Gordon ELGER, Ralph SCHACHT und Bernhard WUNDERLE, 2023. Realization, multi-field coupled simulation and characterization of a thermo-mechanically robust LiDAR front end on a copper coated glass substrate. Proceedings: IEEE 73rd Electronic Components and Technology Conference, ECTC 2023. Piscataway: IEEE, Page 753-760. ISBN 979-8-3503-3498-2. Available at: https://doi.org/10.1109/ECTC51909.2023.00131
AGRAWAL, Shiva, Savankumar BHANDERI, Kristina DOYCHEVA und Gordon ELGER, 2023. Static multi-target-based auto-calibration of RGB cameras, 3D Radar, and 3D Lidar sensors. IEEE Sensors Journal, 23(18), 21493-21505. ISSN 1530-437X. Available at: https://doi.org/10.1109/JSEN.2023.3300957
SCHMID, Maximilian, Marcel MOMBERG, Marcel KETTELGERDES und Gordon ELGER, 2023. Transient thermal analysis for VCSEL Diodes. 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 979-8-3503-1862-3. Available at: https://doi.org/10.1109/THERMINIC60375.2023.10325906
2022
PANDEY, Amit, Sri Krishna BHOGARAJU, Kerstin LUX und Gordon ELGER, 2022. Analysis of stress in spherically bent thinned image sensors. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE. ISBN 978-1-6654-5836-8. Available at: https://doi.org/10.1109/EuroSimE54907.2022.9758847
STRECK, Egor, Reinhold HERSCHEL, Patrick WALLRATH, M. SUNDERAM und Gordon ELGER, 2022. Comparison of Two Different Radar Concepts for Pedestrian Protection on Bus Stops. In: PRASAD, Venkatesha, Dirk PESCH, Nirwan ANSARI und César BENAVENTE-PECES, Editors Proceedings of the 11th International Conference on Sensor Networks. Setúbal: SciTePress, Page 89-96. ISBN 978-989-758-551-7. Available at: https://doi.org/10.5220/0010777100003118
AGRAWAL, Shiva, Rui SONG, Akhil KOHLI, Andreas KORB, Maximilian ANDRE, Erik HOLZINGER und Gordon ELGER, 2022. Concept of Smart Infrastructure for Connected Vehicle Assist and Traffic Flow Optimization. In: PLOEG, Jeroen, Markus HELFERT, Karsten BERNS und Oleg GUSIKHIN, Editors Proceedings of the 8th International Conference on Vehicle Technology and Intelligent Transport Systems. Setúbal: SciTePress, Page 360-367. ISBN 978-989-758-573-9. Available at: https://doi.org/10.5220/0011068800003191
SCHMID, Maximilian, Joseph HERMANN, E LIU und Gordon ELGER, 2022. Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints. Proceedings of the Twenty First InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2022. Piscataway: IEEE. ISBN 978-1-6654-8503-6. Available at: https://doi.org/10.1109/iTherm54085.2022.9899664
HERMANN, Joseph, Maximilian SCHMID und Gordon ELGER, 2022. Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data. THERMINIC 2022: Proceedings 2022. Piscataway: IEEE. ISBN 978-1-6654-9229-4. Available at: https://doi.org/10.1109/THERMINIC57263.2022.9950673
SACCON, Rodolfo, Alice BENIN, Sri Krishna BHOGARAJU und Gordon ELGER, 2022. Effect of binders on the performance of copper sintering pastes. 2022 International Conference on Electronics Packaging (ICEP 2022). Piscataway (NJ): IEEE, Page 71-72. ISBN 978-4-9911911-3-8. Available at: https://doi.org/10.23919/ICEP55381.2022.9795555
MOHAN, Nihesh, Stefan LANGER und Gordon ELGER, 2022. Fluxfree solder paste and process for standard SMD components. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE, Page 163-168. ISBN 978-1-6654-8947-8. Available at: https://doi.org/10.1109/ESTC55720.2022.9939528
LIU, E, Sri Krishna BHOGARAJU, Kerstin LUX, Gordon ELGER und Rokeya Mumtahana MOU, 2022. Investigation Of Stress Generated By Interconnection Processes With Micro-Raman Spectroscopy (μRS). Proceedings IEEE 72nd Electronic Components and Technology Conference: ECTC 2022. Piscataway: IEEE, Page 739-745. ISBN 978-1-6654-7943-1. Available at: https://doi.org/10.1109/ECTC51906.2022.00123
LIU, E, Sri Krishna BHOGARAJU, Bernhard WUNDERLE und Gordon ELGER, 2022. Investigation of stress relaxation in SAC305 with micro-Raman spectroscopy. Microelectronics Reliability, 2022(138), 114664. ISSN 0026-2714. Available at: https://doi.org/10.1016/j.microrel.2022.114664
SCHMID, Maximilian, Andreas ZIPPELIUS, Alexander HANSS, Stephan BÖCKHORST und Gordon ELGER, 2022. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I - Initial Characterization. IEEE Transactions on Device and Materials Reliability, 22(2), 175-186. ISSN 1530-4388. Available at: https://doi.org/10.1109/TDMR.2022.3152590
SCHWAN, Hannes, Maximilian SCHMID und Gordon ELGER, 2022. Laser Stimulated Transient Thermal Analysis of Semiconductors. THERMINIC 2022: Proceedings 2022. Piscataway: IEEE. ISBN 978-1-6654-9229-4. Available at: https://doi.org/10.1109/THERMINIC57263.2022.9950672
BHOGARAJU, Sri Krishna, Maximilian SCHMID, E LIU, Rodolfo SACCON, Gordon ELGER, Holger KLASSEN, Klaus MÜLLER und Georg PIRZER, 2022. Low cost copper based sintered interconnect material for optoelectronics packaging. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). Piscataway: IEEE, Page 1720-1725. ISBN 978-1-6654-7943-1. Available at: https://doi.org/10.1109/ECTC51906.2022.00270
KETTELGERDES, Marcel und Gordon ELGER, 2022. Modeling Methodology and In-field Measurement Setup to Develop Empiric Weather Models for Solid-State LiDAR Sensors. 2022 IEEE 2nd International Conference on Digital Twins and Parallel Intelligence (DTPI). Piscataway: IEEE. ISBN 978-1-6654-9227-0. Available at: https://doi.org/10.1109/DTPI55838.2022.9998918
ZIPPELIUS, Andreas, Tobias STROBL, Maximilian SCHMID, Joseph HERMANN, Alwin HOFFMANN und Gordon ELGER, 2022. Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE, Page 566-575. ISBN 978-1-6654-8947-8. Available at: https://doi.org/10.1109/ESTC55720.2022.9939465
MEESS, Henri, Jeremias GERNER, Daniel HEIN, Stefanie SCHMIDTNER und Gordon ELGER, 2022. Real World Traffic Optimization by Reinforcement Learning: A Concept. In: KIEU, Minh Le, Koen H. van DAM, Jason THOMPSON, Nick MALLESON, Alison HEPPENSTALL und Jiaqi GE, Editors International Workshop on Agent-Based Modelling of Urban Systems (ABMUS) Proceedings: 2022. [s. l.]: figshare, Page 49-54. Available at: https://doi.org/10.6084/m9.figshare.19733800.v1
MEESS, Henri, Jeremias GERNER, Daniel HEIN, Stefanie SCHMIDTNER und Gordon ELGER, 2022. Reinforcement Learning for Traffic Signal Control Optimization: A Concept for Real-World Implementation. AAMAS '22: Proceedings of the 21st International Conference on Autonomous Agents and Multiagent Systems. Richland: International Foundation for Autonomous Agents and Multiagent Systems, Page 1699-1701. ISBN 978-1-4503-9213-6. Available at: https://dl.acm.org/doi/10.5555/3535850.3536081
ZIPPELIUS, Andreas, Alexander HANSS, Maximilian SCHMID, Judith PÉREZ-VELÁZQUEZ und Gordon ELGER, 2022. Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks. Microelectronics Reliability, 2022(129), 114461. ISSN 0026-2714. Available at: https://doi.org/10.1016/j.microrel.2021.114461
SCHMID, Maximilian, Joseph HERMANN, Sri Krishna BHOGARAJU und Gordon ELGER, 2022. Reliability of SAC Solders under Low and High Stress Conditions. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE, Page 553-559. ISBN 978-1-6654-8947-8. Available at: https://doi.org/10.1109/ESTC55720.2022.9939394
TAVAKOLIBASTI, M., P. MESZMER, Marcel KETTELGERDES, Gunnar BÖTTGER, Gordon ELGER, Hüseyin ERDOGAN, A. SESHADITYA und Bernhard WUNDERLE, 2022. Structural-thermal-optical-performance (STOP) analysis of a lens stack for realization of a digital twin of an automotive LiDAR. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE. ISBN 978-1-6654-5836-8. Available at: https://doi.org/10.1109/EuroSimE54907.2022.9758897
SCHWAN, Hannes, Johannes PFORR und Gordon ELGER, 2022. ZVS Class E2 Wireless Power Transfer System with Self-Resonant Transmission Coils for the Biomedical Application. In: MESAGO MESSE FRANKFURT GMBH,, Editors PCIM Europe 2022: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Berlin: VDE Verlag. ISBN 978-3-8007-5822-7. Available at: https://doi.org/10.30420/565822107
2021
SCHMID, Maximilian, Sri Krishna BHOGARAJU, Alexander HANSS und Gordon ELGER, 2021. A new noise-suppression algorithm for transient thermal analysis in semiconductors over pulse superposition. IEEE Transactions on Instrumentation and Measurement, 70, 6500409. ISSN 0018-9456. Available at: https://doi.org/10.1109/TIM.2020.3011818
LIU, E, Maximilian SCHMID, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Advanced location resolved transient thermal analysis. 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE, Page 191-196. ISBN 978-1-7281-7643-7. Available at: https://doi.org/10.1109/THERMINIC49743.2020.9420538
SCHMID, Maximilian, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Characterization of copper sintered interconnects by transient thermal analysis. 2021 International Conference on Electronics Packaging (ICEP 2021). Piscataway: IEEE, Page 71-72. ISBN 978-4-9911-9111-4. Available at: https://doi.org/10.23919/ICEP51988.2021.9451966
AGRAWAL, Shiva und Gordon ELGER, 2021. Concept of infrastructure based environment perception for IN2Lab test field for automated driving. 2021 IEEE International Smart Cities Conference (ISC2). Piscataway: IEEE. ISBN 978-1-6654-4919-9. Available at: https://doi.org/10.1109/ISC253183.2021.9562894
KETTELGERDES, Marcel, Lena BÖHM und Gordon ELGER, 2021. Correlating Intrinsic Parameters and Sharpness for Condition Monitoring of Automotive Imaging Sensors. 2021 5th International Conference on System Reliability and Safety (ICSRS). Piscataway: IEEE, Page 298-306. ISBN 978-1-6654-0049-7. Available at: https://doi.org/10.1109/ICSRS53853.2021.9660665
SCHMID, Maximilian, Sri Krishna BHOGARAJU, Andreas RIEDEL und Gordon ELGER, 2021. Development of an in-line capable transient thermal analysis equipment for a power module with five half bridges. 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE, Page 268-273. ISBN 978-1-7281-7643-7. Available at: https://doi.org/10.1109/THERMINIC49743.2020.9420493
BHOGARAJU, Sri Krishna, Hiren R. KOTADIA, Fosca CONTI, Armin MAUSER, Thomas RUBENBAUER, Robert BRUETTING, Martin SCHNEIDER-RAMELOW und Gordon ELGER, 2021. Die-attach bonding with etched micro brass metal pigment flakes for high-power electronics packaging. ACS Applied Electronic Materials, 3(10), 4587-4603. ISSN 2637-6113. Available at: https://doi.org/10.1021/acsaelm.1c00721
MOHAN, Nihesh, Sri Krishna BHOGARAJU, Mateusz LYSIEN, Ludovic SCHNEIDER, Filip GRANEK, Kerstin LUX und Gordon ELGER, 2021. Drop feature optimization for fine trace inkjet printing. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers. Piscataway: IEEE. ISBN 978-0-9568086-7-7. Available at: https://doi.org/10.23919/EMPC53418.2021.9585004
KLEINER, Jan, Alexander HEIDER, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2021. Experimental Study on the Thermal Interactions in Novel Intelligent Lithium-Ion Modules for Electric Vehicles. Proceedings of the Twentieth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems: ITherm 2021. Piscataway: IEEE, Page 556-562. ISBN 978-1-7281-8539-2. Available at: https://doi.org/10.1109/ITherm51669.2021.9503299
MOKHTARI, Omid, Fosca CONTI, Rodolfo SACCON, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure. New Journal of Chemistry, 45(43), 20133-20139. ISSN 1369-9261. Available at: https://doi.org/10.1039/D1NJ02476K
BHOGARAJU, Sri Krishna, Maximilian SCHMID, Hiren R. KOTADIA, Fosca CONTI und Gordon ELGER, 2021. Highly reliable die-attach bonding with etched brass flakes. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC): Technical Papers. Piscataway: IEEE. ISBN 978-0-9568086-7-7. Available at: https://doi.org/10.23919/EMPC53418.2021.9584967
BHOGARAJU, Sri Krishna, Maximilian SCHMID, Elias HUFNAGEL, Fosca CONTI, Hiren R. KOTADIA und Gordon ELGER, 2021. Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste. IEEE 71st Electronic Components and Technology Conference ECTC 2021, Proceedings. Piscataway: IEEE, Page 526-531. ISBN 978-1-6654-4097-4. Available at: https://doi.org/10.1109/ECTC32696.2021.00094
PASCUCCI, Jacopo, Fosca CONTI, Sri Krishna BHOGARAJU, Raffaella SIGNORINI, E LIU, Danilo PEDRON und Gordon ELGER, 2021. Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates. In: CHEBEN, Pavel, Jiří ČTYROKÝ und Iñigo MOLINA-FERNÁNDEZ, Editors Integrated Optics: Design, Devices, Systems and Applications VI. Bellingham: SPIE. ISBN 978-1-5106-4385-7. Available at: https://doi.org/10.1117/12.2576414
THEISSLER, Andreas, Judith PÉREZ-VELÁZQUEZ, Marcel KETTELGERDES und Gordon ELGER, 2021. Predictive maintenance enabled by machine learning: use cases and challenges in the automotive industry. Reliability Engineering & System Safety, 2021(215), 107864. ISSN 0951-8320. Available at: https://doi.org/10.1016/j.ress.2021.107864
CONTI, Fosca, Kerstin LUX, Sri Krishna BHOGARAJU, E LIU, Christoph LENZ, Roland SEITZ und Gordon ELGER, 2021. Raman spectroscopy to investigate gallium nitride light emitting diodes after assembling onto copper substrates. In: BALDINI, Francesco, Jiri HOMOLA und Robert A. LIEBERMAN, Editors Optical Sensors 2021. Bellingham: SPIE. ISBN 978-1-5106-4379-6. Available at: https://doi.org/10.1117/12.2591947
STRECK, Egor, Peter SCHMOK, Klaus SCHNEIDER, Hüseyin ERDOGAN und Gordon ELGER, 2021. Safeguarding future autonomous traffic by infrastructure based on multi radar sensor systems. FISITA World Congress 2021. Bishops Stortford: FISITA. Available at: https://www.fisita.com/library/f2021-acm-121
SENEL, Numan, Shrivatsa UDUPA und Gordon ELGER, 2021. Sensor data preprocessing in road-side sensor units. FISITA World Congress 2021. Bishops Stortford: FISITA. Available at: https://www.fisita.com/library/f2021-acm-120
LIU, E, Fosca CONTI, Sri Krishna BHOGARAJU und Gordon ELGER, 2021. Simulations and experiments to analyze stress phenomena in soldered and sintered interconnections between silicon nitride chips and copper substrates. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-6654-1373-2. Available at: https://doi.org/10.1109/EuroSimE52062.2021.9410869
CONTI, Fosca, E LIU, Sri Krishna BHOGARAJU, Christoph LENZ, Roland SEITZ und Gordon ELGER, 2021. Stress evaluations of silicon nitride chips bonded onto copper substrates via SAC soldering, AuSn soldering, and copper sintering. 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE, Page 204-208. ISBN 978-1-7281-7643-7. Available at: https://doi.org/10.1109/THERMINIC49743.2020.9420523
KLEINER, Jan, Lorenz LECHERMANN, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2021. Thermal behavior of intelligent automotive lithium-ion batteries: operating strategies for adaptive thermal balancing by reconfiguration. Journal of energy storage, 2021(40), 102686. ISSN 2352-152X. Available at: https://doi.org/10.1016/j.est.2021.102686
KLEINER, Jan, Alexander HEIDER, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2021. Thermal behavior of intelligent automotive lithium-ion batteries: Experimental study with switchable cells and reconfigurable modules. Journal of Energy Storage, 2021(44), 103274. ISSN 2352-152X. Available at: https://doi.org/10.1016/j.est.2021.103274
TAVAKOLIBASTI, M., P. MESZMER, Gunnar BÖTTGER, Marcel KETTELGERDES, Gordon ELGER, Hüseyin ERDOGAN, A. SESHADITYA und Bernhard WUNDERLE, 2021. Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-6654-1373-2. Available at: https://doi.org/10.1109/EuroSimE52062.2021.9410831
2020
ELGER, Gordon, Omid MOKHTARI, Sri Krishna BHOGARAJU, Fosca CONTI, Markus MEIER und Helmut SCHWEIGART, 2020. Analyse der Reaktionsprodukte von Metall-Formiaten im rückstandfreien Lötprozess. GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten. Berlin: VDE Verlag. ISBN 978-3-8007-5185-3. Available at: https://www.vde-verlag.de/proceedings-de/455185053.html
KÜHN, Stephan, Amit PANDEY, Andreas ZIPPELIUS, Klaus SCHNEIDER, Hüseyin ERDOGAN und Gordon ELGER, 2020. Analysis of package design of optic modules for automotive cameras to realize reliable image sharpness. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-7281-6293-5. Available at: https://doi.org/10.1109/ESTC48849.2020.9229786
ZIPPELIUS, Andreas, Alexander HANSS, E LIU, Maximilian SCHMID, Judith PÉREZ-VELÁZQUEZ und Gordon ELGER, 2020. Comparing prediction methods for LED failure measured with Transient Thermal Analysis. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-7281-6049-8. Available at: https://doi.org/10.1109/EuroSimE48426.2020.9152657
SCHMID, Maximilian, Sri Krishna BHOGARAJU, E LIU und Gordon ELGER, 2020. Comparison of Nondestructive Testing Methods for Solder, Sinter, and Adhesive Interconnects in Power and Opto-Electronics. Applied Sciences, 10(23), 8516. ISSN 2076-3417. Available at: https://doi.org/10.3390/app10238516
BHOGARAJU, Sri Krishna, Fosca CONTI und Gordon ELGER, 2020. Copper die bonding using copper formate based pastes with α-terpineol, amino-2-propanol and hexylamine as binders. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-7281-6293-5. Available at: https://doi.org/10.1109/ESTC48849.2020.9229801
BHOGARAJU, Sri Krishna, Fosca CONTI, Maximilian SCHMID, Markus MEIER, Helmut SCHWEIGART und Gordon ELGER, 2020. Development of sinter paste with surface modified copper alloy particles for die-attach bonding. ETG-Fachbericht 161, CIPS 2020, 11th International Conference on Integrated Power Electronics Systems. Berlin: VDE Verlag, Page 582-587. ISBN 978-3-8007-5226-3. Available at: https://www.vde-verlag.de/proceedings-de/455225100.html
BHOGARAJU, Sri Krishna, Omid MOKHTARI, Fosca CONTI und Gordon ELGER, 2020. Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol. Scripta Materialia, 2020(182), 74-80. ISSN 1359-6462. Available at: https://doi.org/10.1016/j.scriptamat.2020.02.045
PANDEY, Amit, Stephan KÜHN, Hüseyin ERDOGAN, Klaus SCHNEIDER und Gordon ELGER, 2020. Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-7281-6049-8. Available at: https://doi.org/10.1109/EuroSimE48426.2020.9152716
CONTI, Fosca, E LIU, Sri Krishna BHOGARAJU, Bernhard WUNDERLE und Gordon ELGER, 2020. Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-7281-6293-5. Available at: https://doi.org/10.1109/ESTC48849.2020.9229843
BHOGARAJU, Sri Krishna, Omid MOKHTARI, Jacopo PASCUCCI, Alexander HANSS, Maximilian SCHMID, Fosca CONTI und Gordon ELGER, 2020. Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging. Proceedings 22nd European Microelectronics and Packaging Conference, EMPC. Piscataway: IEEE. ISBN 978-1-7281-6291-1. Available at: https://doi.org/10.23919/EMPC44848.2019.8951887
KLEINER, Jan, Randeep SINGH, Michael SCHMID, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2020. Influence of heat pipe assisted terminal cooling on the thermal behavior of a large prismatic lithium-ion cell during fast charging in electric vehicles. Applied Thermal Engineering, 2021(188), 116328. ISSN 1359-4311. Available at: https://doi.org/10.1016/j.applthermaleng.2020.116328
BHOGARAJU, Sri Krishna, Fosca CONTI, Hiren R. KOTADIA, Simon KEIM, Ulrich TETZLAFF und Gordon ELGER, 2020. Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging. Journal of Alloys and Compounds, 2020(844), 156043. ISSN 1873-4669. Available at: https://doi.org/10.1016/j.jallcom.2020.156043
SENEL, Numan, Gordon ELGER und Andreas FESTAG, 2020. Sensor Time Synchronization in Smart Road Infrastructure. FISITA Web Congress 2020. Bishops Stortford: FISITA. Available at: https://www.fisita.com/library/f2020-acm-083
DA ROSA ZANATTA, Mateus, Joao Paulo CARVALHO LUSTOSA DA COSTA, Felix ANTREICH, Martin HAARDT, Gordon ELGER, Fábio Lúcio LOPES DE MENDONÇA und Rafael Timóteo DE SOUSA JUNIOR, 2020. Tensor-based framework with model order selection and high accuracy factor decomposition for time-delay estimation in dynamic multipath scenarios. IEEE Access, 8, 174931-174942. ISSN 2169-3536. Available at: https://doi.org/10.1109/ACCESS.2020.3024597
KEIM, Simon, Ulrich TETZLAFF und Gordon ELGER, 2020. The influence of different-sized Ni micro- and nanopowders on the processing and microstructural properties of Sn-Ag-Cu-solder with low Ag content. Proceedings: IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Piscataway: IEEE, Page 2005-2012. ISBN 978-1-7281-6180-8. Available at: https://doi.org/10.1109/ECTC32862.2020.00312
KLEINER, Jan, Alexander HEIDER, Christian HANZL, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2020. Thermal behavior of an intelligent li-ion cell under vehicle conditions. Proceedings: IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society. Piscataway: IEEE, Page 2081-2086. ISBN 978-1-7281-5414-5. Available at: https://doi.org/10.1109/IECON43393.2020.9254336
LIU, E, Fosca CONTI, Sri Krishna BHOGARAJU, Raffaella SIGNORINI, Danilo PEDRON, Bernhard WUNDERLE und Gordon ELGER, 2020. Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using finite element method and Raman spectroscopy. Journal of Raman Spectroscopy, 51(10), 2083-2094. ISSN 1097-4555. Available at: https://doi.org/10.1002/jrs.5947
2019
BHOGARAJU, Sri Krishna, Omid MOKHTARI, Jacopo PASCUCCI, Fosca CONTI, Hiren R. KOTADIA und Gordon ELGER, 2019. A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization. International Symposium on Microelectronics. Pittsburgh: IMAPS, Page 387-392. Available at: https://doi.org/10.4071/2380-4505-2019.1.000387
SCHMID, Maximilian, Sri Krishna BHOGARAJU und Gordon ELGER, 2019. Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). Piscataway: IEEE, Page 2324-2330. ISBN 978-1-7281-1499-6. Available at: https://doi.org/10.1109/ECTC.2019.00320
MOKHTARI, Omid, Fosca CONTI, Sri Krishna BHOGARAJU, Markus MEIER, Helmut SCHWEIGART, Ulrich TETZLAFF und Gordon ELGER, 2019. Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor. New Journal of Chemistry, 43(26), 10227-10231. ISSN 1369-9261. Available at: https://doi.org/10.1039/C9NJ02135C
HANSS, Alexander, Maximilian SCHMID und Gordon ELGER, 2019. Combined Accelerated Stress Test with In-Situ Thermal Impedance Monitoring to Access LED Reliability. Proceedings 2018 20th International Conference on Electronic Materials and Packaging (EMAP). Piscataway: IEEE. ISBN 978-1-5386-5642-6. Available at: https://doi.org/10.1109/EMAP.2018.8660833
HANSS, Alexander, E LIU, Muhammad Rizwan ABDULLAH und Gordon ELGER, 2019. Failure Identification in LED packages by Transient Thermal Analysis and Calibrated FE Models. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-5386-8040-7. Available at: https://doi.org/10.1109/EuroSimE.2019.8724558
BHOGARAJU, Sri Krishna, Omid MOKHTARI, Jacopo PASCUCCI, Fosca CONTI und Gordon ELGER, 2019. Improved sinterability of particles to substrates by surface modifications on substrate metallization. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). Pittsburgh (PA): IMAPS, Page 66-70. Available at: https://doi.org/10.4071/2380-4491.2019.HiTen.000066
BRUGNOLOTTO, Enrico, Sri Krishna BHOGARAJU, E LIU, Fosca CONTI, Danilo PEDRON, Raffaella SIGNORINI und Gordon ELGER, 2019. Investigation of thermomechanical local stress induced in assembled GaN LEDs. 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-7281-2078-2. Available at: https://doi.org/10.1109/THERMINIC.2019.8923629
KLEINER, Jan, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2019. Modelling of 3D temperature behavior of prismatic lithium-ion cell with focus on experimental validation under battery electric vehicle conditions. 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-7281-2078-2. Available at: https://doi.org/10.1109/THERMINIC.2019.8923604
ELGER, Gordon, E LIU, Fosca CONTI, Raffaella SIGNORINI, Enrico BRUGNOLOTTO und Sri Krishna BHOGARAJU, 2019. Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments. 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway: IEEE. ISBN 978-1-5386-8040-7. Available at: https://doi.org/10.1109/EuroSimE.2019.8724533
KLEINER, Jan, Lidiya KOMSIYSKA, Gordon ELGER und Christian ENDISCH, 2019. Thermal modelling of a prismatic lithium-ion cell in a battery electric vehicle environment: influences of the experimental validation setup. Energies, 13(1), 62. ISSN 1996-1073. Available at: https://doi.org/10.3390/en13010062
SIGNORINI, Raffaella, Fosca CONTI, Enrico BRUGNOLOTTO, Danilo PEDRON, E LIU, Sri Krishna BHOGARAJU und Gordon ELGER, 2019. Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy. In: CHEBEN, Pavel, Jiří ČTYROKÝ und Iñigo MOLINA-FERNÁNDEZ, Editors Integrated Optics: Design, Devices, Systems, and Applications V. Bellingham: SPIE. ISBN 978-1-5106-2729-1. Available at: https://doi.org/10.1117/12.2520992
SCHMID, Maximilian, Alexander HANSS, Sri Krishna BHOGARAJU und Gordon ELGER, 2019. Time saving averaging algorithm for transient thermal analyses over deterministic pulse superposition. 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-7281-2078-2. Available at: https://doi.org/10.1109/THERMINIC.2019.8923548
2018
BHOGARAJU, Sri Krishna, Alexander HANSS, Maximilian SCHMID, Gordon ELGER und Fosca CONTI, 2018. Evaluation of silver and copper sintering of first level interconnects for high power LEDs. 2018 7th Electronic System-Integration Technology Conference (ESTC). Piscataway: IEEE. ISBN 978-1-5386-6814-6. Available at: https://doi.org/10.1109/ESTC.2018.8546499
CONTI, Fosca, Alexander HANSS, Omid MOKHTARI, Sri Krishna BHOGARAJU und Gordon ELGER, 2018. Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor. New Journal of Chemistry, 42(23), 19232-19236. ISSN 1369-9261. Available at: https://doi.org/10.1039/C8NJ04173C
SCHMID, Maximilian und Gordon ELGER, 2018. Measurement of the transient thermal impedance of MOSFETs over the sensitivity of the threshold voltage. EPE'18 ECCE Europe. Piscataway: IEEE. ISBN 978-9-0758-1528-3. Available at: https://ieeexplore.ieee.org/document/8515480
HANSS, Alexander, Maximilian SCHMID, Sri Krishna BHOGARAJU, Fosca CONTI und Gordon ELGER, 2018. Process development and reliability of sintered high power chip size packages and flip chip LEDs. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). Piscataway: IEEE, Page 479-484. ISBN 978-4-9902-1885-0. Available at: https://doi.org/10.23919/ICEP.2018.8374351
HANSS, Alexander, Maximilian SCHMID, Sri Krishna BHOGARAJU, Fosca CONTI und Gordon ELGER, 2018. Reliability of sintered and soldered high power chip size packages and flip chip LEDs. ECTC - The 2018 IEEE 68th Electronic Components and Technology Conference: Proceedings. Piscataway: IEEE, Page 2080-2088. ISBN 978-1-5386-5000-4. Available at: https://doi.org/10.1109/ECTC.2018.00312
HANSS, Alexander und Gordon ELGER, 2018. Residual free solder process for fluxless solder pastes. Soldering & Surface Mount Technology, 30(2), 118-128. ISSN 0954-0911. Available at: https://doi.org/10.1108/SSMT-10-2017-0030
ELGER, Gordon, M. BIBERGER, M. MEIER, Helmut SCHWEIGART, Klaus SCHNEIDER und Hüseyin ERDOGAN, 2018. Technische Sauberkeit von Radarbaugruppen. Elektronische Baugruppen und Leiterplatten EBL 2018: Multifunktionale Aufbau- und Verbindungstechnik – Beherrschung der Vielfalt. Düsseldorf: DVS Media GmbH, Page 339-349. ISBN 978-3-96144-026-9. Available at: https://www.dvs-media.eu/de/buecher/dvs-berichte/3644/elektronische-baugruppen-und-leiterplatten-ebl-2018
SIGNORINI, Raffaella, Danilo PEDRON, Fosca CONTI, Alexander HANSS, Sri Krishna BHOGARAJU und Gordon ELGER, 2018. Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling. 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-5386-6759-0. Available at: https://doi.org/10.1109/THERMINIC.2018.8593304
ELGER, Gordon, Alexander HANSS und Maximilian SCHMID, 2018. Transient Thermal Analysis as In-Situ Method in Accelerated Stress Tests to Access Package Integrity of LEDs. 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). Piscataway: IEEE. ISBN 978-1-5386-6759-0. Available at: https://doi.org/10.1109/THERMINIC.2018.8593278
2015
HANSS, Alexander, Maximilian SCHMID, E LIU und Gordon ELGER, 2015. Transient thermal analysis as measurement method for IC package structural integrity. Chinese Physics B, 24(6), 068105. ISSN 2058-3834. Available at: https://doi.org/10.1088/1674-1056/24/6/068105